The Conference Program for the 5th International Conference on Heat Transfer and Fluid Flow (HTFF'18) will be available soon. We appreciate your patience!

HTFF'18 is part of the 4th World Congress on Mechanical, Chemical, and Material Engineering (MCM'18). Congress Website | Congress Flyer


Upcoming Dates

Feb. 9, 2018
Extended
Paper Submission Deadline
Mar. 1, 2018
Extended
Notification to Authors
Apr. 20, 2018
Extended
Early-Bird Registration

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