The Conference Program for the 6th International Conference on Heat Transfer and Fluid Flow (HTFF'19) will be available soon. We appreciate your patience!

HTFF'19 is part of the 5th World Congress on Mechanical, Chemical, and Material Engineering (MCM'19). Congress Website | Congress Flyer


Upcoming Dates

Feb. 08, 2019
May 24, 2019
Paper Submission Deadline
Final Extended Paper Submission Deadline
June 5, 2019
Notification to Authors
June 18, 2019
Early-Bird Registration

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