The keynote information for the 6th International Conference on Heat Transfer and Fluid Flow (HTFF'19) will be announced soon. We appreciate your patience!

HTFF'19 is part of the 5th World Congress on Mechanical, Chemical, and Material Engineering (MCM'19). Congress Website | Congress Flyer


Upcoming Dates

Feb. 8, 2019
Paper Submission Deadline
Mar. 1, 2019
Notification to Authors
Mar. 15, 2019
Early-Bird Registration

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